To provide increased production capacity and flexibility while reducing supply risk, Impinj is qualifying an additional semiconductor wafer fabrication facility for Impinj Monza R6 and R6-P tag chips. This notification establishes the timeline for production from the new site, allowing you the time to conduct any qualification steps that may be required. Impinj Monza R6 and R6-P tag chips fabricated in the new facility are form, fit, and function compatible with existing Monza R6 and R6-P tag chips. Tag chips produced at both facilities will have the same part number (see table below).
|Impinj Product Name||Impinj Ordering Part Number||Additional Facility Qualification Date|
|Impinj Monza R6||IPJ-W1700-K00||March 2023|
|Impinj Monza R6-P||IPJ-W1710-K00||March 2023|
Electrical characterization and reliability testing is in progress and expected to be completed in February 2023. The qualification report for products made in the new facility will subsequently be available upon request.
All Impinj Monza R6 and R6-P shipments prior to March 1, 2023, will be sourced solely from the existing manufacturing facility. Thereafter, Impinj Monza R6 and Monza R6-P shipments may ship from either facility. No changes are required to open purchase orders.
The first wafers will be available for customer qualification by January 31, 2023. Please contact your Impinj account manager if you wish to order a qualification wafer. For additional questions, please contact your Impinj Account Manager, or email our support team at firstname.lastname@example.org.