Expanded Impinj wafer manufacturing (test and bumping) capability qualification and production
As part of our continuous process improvement strategy, Impinj is qualifying Chipbond Technology Corporation in Hsinchu Technology Park, Hsinchu, Taiwan, R.O.C. as an additional source for Wafer Test and Enduro Bumping. Qualification to ensure no change to device functionality is expected to be completed by 17th May 2019. Qualification data will be available to customers thereafter upon request. Customers can expect to receive product processed from the new facility no earlier than 12th July 2019, except when there is a previous mutual agreement between Impinj and the customer.
The specific products affected by this notice are:
- Monza R6
- Monza R6-A
- Monza R6-B
- Monza R6-P
Impinj requests acknowledgement of receipt of this notification within 30 days of the date indicated on this letter. Please contact your Impinj sales representative to acknowledge receipt of this notification and if you have questions.