M700 Tag Chip Production Location Addition

Summary

In order to expand Impinj manufacturing capabilities Impinj is adding another manufacturing partner for certain production steps of the M700 series tag chips. This qualification of a new supplier is for wafer dicing, bumping, and testing. This change is effective on all M700 series products effective immediately.

Change

Additional manufacturing partners for M700 series wafer dicing, bumping, and testing.

Product Impact

The form, fit and function of these products are not affected by the addition of these manufacturing partners.

Process Qualification Schedule

Product Name Part Number  New Wafer Dicing Supplier Full Qual Complete New Enduro Bumping Supplier Full Qual Complete
Impinj M730 IPJ-M730A-A00 Q1-2022 Q2-2022
Impinj M750 IPJ-M750A-A00 Q1-2022 Q2-2022
Impinj M770 IPJ-M770A-A00 Q1-2022 Q1-2022

Future additions to the Impinj M700 series may begin production at the new suppliers starting in Q1-2022.

How Do I Get Additional Information?

Please contact your Impinj salesperson or email our support team at support@impinj.com.

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